Retention module, heat sink and electronic device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C165S104330, C165S185000, C257S719000, C361S704000, C361S710000, C361S719000

Reexamination Certificate

active

06992889

ABSTRACT:
It is an object of the present invention to provide a retention module, a heat sink and electronic apparatus for effectively the heat from a chip set. The retention module for a CPU is provided with a heat sink for the chip set.

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patent: WO96/42044 (1996-12-01), None

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