Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-01-31
2006-01-31
Thompson, Gregory (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S104330, C165S185000, C257S719000, C361S704000, C361S710000, C361S719000
Reexamination Certificate
active
06992889
ABSTRACT:
It is an object of the present invention to provide a retention module, a heat sink and electronic apparatus for effectively the heat from a chip set. The retention module for a CPU is provided with a heat sink for the chip set.
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Kashiwagi Toshiyuki
Katou Hirokatsu
Fujitsu Limited
Thompson Gregory
Westerman Hattori Daniels & Adrian LLP
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