Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-08-03
2002-07-09
Talbott, David L. (Department: 2827)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S740000, C361S741000, C361S807000, C361S825000, C439S377000, C439S564000, C439S567000, C439S573000, C211S041170
Reexamination Certificate
active
06418035
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a retention mechanism for securing an upright CPU module to a socket connector mounted on a printed circuit board (PCB), and particularly to a retention mechanism having an improved hold-down structure for securing the retention mechanism to the PCB.
2. Description of the Prior Art
A retention mechanism has been developed to retain an upright CPU module in a slot connector mounted on a mother board, as is disclosed in prior art Taiwan patent application Nos. 86211054 and 86207803 and U.S. Pat. No. 6,031,725.
Referring to
FIG. 6
, a prior art retention mechanism
4
comprises a retention housing
40
, at least one board lock post
60
and at least one pin
50
fitting in the post
60
. The housing
40
has a rear wall
41
and a pair of bottom plates
42
extending forward from the rear wall
41
. A slot
43
is defined in a middle, lower portion of the housing
40
and between a pair of side walls
45
for fittingly receiving one end of a slot connector (not shown) mounted on a PCB (not shown). The board lock post
60
comprises a cylindric head
61
and an insertion leg
63
to be inserted through a hole
44
defined in the bottom plate
42
and retained in the PCB. A hole
62
is defined in the post
60
. When the pin
50
is inserted into the hole
62
, it expands the insertion leg
63
to complete a secure connection between the retention mechanism
4
and the PCB. A passage
46
is formed between a pair of heat sink fixing brackets
48
and is located above and communicating with the slot
43
. A lateral edge of the CPU module is inserted through the passage
46
to a position where the module is electrically connected with the slot connector.
However, there is no structure which can effectively hold the pin
50
in position in the hole
62
. Thus, the pin
50
may spring out of the post
60
because of vibration during transportation and use, which will result in the retention mechanism
40
not effectively retaining the CPU module to the slot connector, thereby adversely affecting the electrical connection therebetween.
Hence, an improved retention mechanism is required to overcome the disadvantages of the prior art.
BRIEF SUMMARY OF THE INVENTION
A main object of the present invention is to provide a retention mechanism which is provided with a hold-down structure for securing the mechanism to a PCB.
To fulfil the above mentioned object, a retention mechanism of the present invention comprises a retention housing, a pair of board lock posts extending through a bottom plate of the housing and retained in the PCB and a pair of pins. The retention housing defines a slot for effectively accommodating one end of an electrical connector therein and comprises a rear wall from which at least a stopper projects. Each pin comprises a head portion and a pin body inserted in a corresponding board lock post. The head portion is formed by symmetrically cutting out two arc portions from a dummy cylinder and comprises a pair of planar side surfaces and a pair of arcuate side surfaces. A distance between a longitudinal axis of the pin body and a front face of the stopper is shorter than that between the axis and an arcuate side surface, while it is longer than that between the axis and the planar side surface. The pin is rotatably turned a proper angle in a corresponding board lock post so that the head portion thereof is depressed by a corresponding stopper, which keeps the pin from springing out of the post during transportation and use.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description of the present embodiment when taken in conjunction with the accompanying drawings.
REFERENCES:
patent: 5829601 (1998-11-01), Yurchenko et al.
patent: 6031725 (2000-02-01), Scholder et al.
patent: 6098938 (2000-08-01), Tsai
patent: 6112911 (2000-09-01), Laurx
patent: 6116566 (2000-09-01), Brown et al.
patent: 6147873 (2000-11-01), Huang
Chung Wei Te
Hon Hai - Precision Ind. Co., Ltd.
Talbott David L.
Vigushin John B.
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