Retention mechanism for heat sink

Details Retention mechanism for heat sink Retention mechanism for heat sink

1999-10-15

2000-08-01

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361695, 361707, 361710, 361717, 257706, 257707, 257713, 174 161, 174 163, 165 803, 165122, 165185, H05K 720

Patent

active

060976012

ABSTRACT:
A retention mechanism for securely engaging a heat sink with a CPU module comprises a base plate and a guiding member. The base plate has a H-shaped main body and two pairs of mounting legs upwardly extending from corners thereof for engaging with a CPU module and a heat sink. Each mounting leg forms a resilient tip on a free end thereof and a pair of cutouts proximate the resilient tip. The guiding member forms a shaft and a pair of latching arms outwardly extending from opposite ends of the shaft. A pair of elongate engaging slots is defined in each latching arm corresponding to the mounting legs. A receiving aperture is defined in communication with each engaging slot for insertion of the tip of the corresponding mounting leg therethrough. A pair of engaging tabs is formed on opposite sides of each engaging slot for engaging with the corresponding cutouts of the mounting legs.

REFERENCES:
patent: 5662163 (1997-09-01), Mira
patent: 5943210 (1999-08-01), Lee
patent: 5973921 (1999-10-01), Lin
patent: 5982622 (1999-11-01), Chiou
patent: 6008990 (1999-12-01), Liu

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