Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1988-05-06
1989-10-10
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439330, 439526, H01R 2372
Patent
active
048728454
ABSTRACT:
Chip carrier sockets (2) have terminals (4) provided therein, the terminals (4) comprising leg portions (34) with first resilient arms (18) and second resilient arms (20) pivotally attached thereto. The first resilient arms (18) have contact surfaces (26) provided on free end sections (22) thereof. The contact surfaces (26) are provided to electrically engage leads (6) of the chip carrier (8). A cover (12) is provided to cooperate with the chip carrier and to act as a protective handler for the chip carrier. Retention means are positioned on the chip carrier socket (2) to cooperate with the cover (12), thereby providing the contact force required to insure that a positive electrical connection is effected between the leads (6) and the terminals (4). The resilient configuration of the retention means insures that the retention means will not fail under normal stresses associated therewith.
REFERENCES:
patent: 3179738 (1965-04-01), De Lyon
patent: 3399374 (1968-08-01), Pauza
patent: 3905665 (1975-09-01), Lynch
patent: 3951495 (1976-04-01), Donaher et al.
patent: 4349238 (1982-09-01), Showman et al.
patent: 4547031 (1985-10-01), Korsunsky
patent: 4623208 (1986-11-01), Kerul et al.
patent: 4752248 (1988-06-01), Rudy
Brown Robert W.
Korsunsky Iosif
Walker Kevin E.
Abrams Neil
AMP Incorporated
Wolstoncroft Bruce J.
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