Retention device for processor module with heat sink

Details Retention device for processor module with heat sink Retention device for processor module with heat sink

1999-01-06

2000-12-12

Tolin, G P

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361719, 361785, 439 64, A05K 720

Patent

active

061607061

ABSTRACT:
A module retention system including a pair of retention assemblies (32) at ends of a board-mounted receptacle connector (36) for securing a processor module (10) thereto, where the module includes a massive heat sink (12) mounted along one side thereof. Each retention assembly (32) includes a resilient member (50) secured along the base of a rigid retention member (38) and against the circuit board (20) that has portions (62,66) engageable by the module leading end (22) and by the heat sink distal end (16) to stabilize the module and to absorb looseness in the arrangement.

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