Retention device for mounting heat sink to CPU socket

Details Retention device for mounting heat sink to CPU socket Retention device for mounting heat sink to CPU socket

1999-12-22

2000-12-12

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 257719, 439 71, 439331, 439487, H05G 720

Patent

active

061607096

ABSTRACT:
A retention device for mounting a heat sink to a CPU socket comprises a pair of supporting members and a pair of pressing members. Each supporting member is pivotably assembled with one pressing member to form a subassembly. The subassemblies straddle opposite ends of the CPU socket, respectively. Each supporting member comprises a supporting portion defining a supporting face thereon and a pair of side portions. The side portions define a pair of through holes therethrough and a pair of side supporting face thereon. The supporting faces together with the side supporting faces support opposite sides of a heat sink having a pair of retention plates extending therefrom thereon. Each pressing member comprises an operating portion and a pressing portion defining an abutting portion to engage with a corresponding retention plate of the heat sink. Each pressing portion forms a pair of axles extending from two opposite outer surfaces thereof to engage with the through holes of the supporting member. The pressing members and the supporting members locate each other with latch mechanism on the pressing portions and the supporting faces thereof.

REFERENCES:
patent: 5493475 (1996-02-01), Lin
patent: 5602719 (1997-02-01), Kinion
patent: 5669784 (1997-09-01), Ito et al.
patent: 5777825 (1998-07-01), Bell

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