Abrading – Abrading process – Glass or stone abrading
Reexamination Certificate
2005-11-08
2005-11-08
Nguyen, George (Department: 3723)
Abrading
Abrading process
Glass or stone abrading
C451S398000, C451S397000, C451S285000, C451S288000
Reexamination Certificate
active
06962520
ABSTRACT:
Retaining rings, planarizing apparatuses including retaining rings, and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, a carrier head for retaining a micro-device workpiece during mechanical or chemical-mechanical polishing includes a workpiece holder configured to receive the workpiece and a retaining ring carried by the workpiece holder. The retaining ring includes an inner surface, an outer surface, a first surface between the inner surface and the outer surface, and a plurality of grooves in the first surface extending from the inner surface to the outer surface. The grooves include at least a first groove and a second groove positioned adjacent and at least substantially transverse to the first groove.
REFERENCES:
patent: 5069002 (1991-12-01), Sandhu et al.
patent: 5081796 (1992-01-01), Schultz
patent: 5232875 (1993-08-01), Tuttle et al.
patent: 5234867 (1993-08-01), Schultz et al.
patent: 5240552 (1993-08-01), Yu et al.
patent: 5244534 (1993-09-01), Yu et al.
patent: 5245790 (1993-09-01), Jerbic
patent: 5245796 (1993-09-01), Miller et al.
patent: RE34425 (1993-11-01), Schultz
patent: 5421769 (1995-06-01), Schultz et al.
patent: 5433651 (1995-07-01), Lustig et al.
patent: 5449314 (1995-09-01), Meikle et al.
patent: 5486129 (1996-01-01), Sandhu et al.
patent: 5514245 (1996-05-01), Doan et al.
patent: 5533924 (1996-07-01), Stroupe et al.
patent: 5540810 (1996-07-01), Sandhu et al.
patent: 5618381 (1997-04-01), Doan et al.
patent: 5643060 (1997-07-01), Sandhu et al.
patent: 5658183 (1997-08-01), Sandhu et al.
patent: 5658190 (1997-08-01), Wright et al.
patent: 5664988 (1997-09-01), Stroupe et al.
patent: 5679065 (1997-10-01), Henderson
patent: 5695392 (1997-12-01), Kim
patent: 5702292 (1997-12-01), Brunelli et al.
patent: 5730642 (1998-03-01), Sandhu et al.
patent: 5747386 (1998-05-01), Moore
patent: 5792709 (1998-08-01), Robinson et al.
patent: 5795495 (1998-08-01), Meikle
patent: 5807165 (1998-09-01), Uzoh et al.
patent: 5830806 (1998-11-01), Hudson et al.
patent: 5851135 (1998-12-01), Sandhu et al.
patent: 5868896 (1999-02-01), Robinson et al.
patent: 5882248 (1999-03-01), Wright et al.
patent: 5893754 (1999-04-01), Robinson et al.
patent: 5895550 (1999-04-01), Andreas
patent: 5930699 (1999-07-01), Bhatia
patent: 5935980 (1999-08-01), Imperato
patent: 5944593 (1999-08-01), Chiu et al.
patent: 5945347 (1999-08-01), Wright
patent: 5954912 (1999-09-01), Moore
patent: 5967030 (1999-10-01), Blalock
patent: 5972792 (1999-10-01), Hudson
patent: 5980363 (1999-11-01), Meikle et al.
patent: 5981396 (1999-11-01), Robinson et al.
patent: 5994224 (1999-11-01), Sandhu et al.
patent: 5997384 (1999-12-01), Blalock
patent: 6004193 (1999-12-01), Nagahara et al.
patent: 6039633 (2000-03-01), Chopra
patent: 6040245 (2000-03-01), Sandhu et al.
patent: 6054015 (2000-04-01), Brunelli et al.
patent: 6066030 (2000-05-01), Uzoh
patent: 6074286 (2000-06-01), Ball
patent: 6083085 (2000-07-01), Lankford
patent: 6110820 (2000-08-01), Sandhu et al.
patent: 6116988 (2000-09-01), Ball
patent: 6120354 (2000-09-01), Koos et al.
patent: 6135856 (2000-10-01), Tjaden et al.
patent: 6139402 (2000-10-01), Moore
patent: 6143123 (2000-11-01), Robinson et al.
patent: 6143155 (2000-11-01), Adams et al.
patent: 6152808 (2000-11-01), Moore
patent: 6176992 (2001-01-01), Talieh
patent: 6180525 (2001-01-01), Morgan
patent: 6183350 (2001-02-01), Lin et al.
patent: 6187681 (2001-02-01), Moore
patent: 6191037 (2001-02-01), Robinson et al.
patent: 6193588 (2001-02-01), Carlson et al.
patent: 6200901 (2001-03-01), Hudson et al.
patent: 6203404 (2001-03-01), Joslyn et al.
patent: 6203413 (2001-03-01), Skrovan
patent: 6206756 (2001-03-01), Chopra et al.
patent: 6210257 (2001-04-01), Carlson
patent: 6213845 (2001-04-01), Elledge
patent: 6218316 (2001-04-01), Marsh
patent: 6224472 (2001-05-01), Lai et al.
patent: 6227955 (2001-05-01), Custer et al.
patent: 6234874 (2001-05-01), Ball
patent: 6234877 (2001-05-01), Koos et al.
patent: 6234878 (2001-05-01), Moore
patent: 6237483 (2001-05-01), Blalock
patent: 6250994 (2001-06-01), Chopra et al.
patent: 6251785 (2001-06-01), Wright
patent: 6261151 (2001-07-01), Sandhu et al.
patent: 6261163 (2001-07-01), Walker et al.
patent: 6267643 (2001-07-01), Teng et al.
patent: 6267650 (2001-07-01), Hembree
patent: 6267655 (2001-07-01), Weldon et al.
patent: 6273786 (2001-08-01), Chopra et al.
patent: 6273796 (2001-08-01), Moore
patent: 6276996 (2001-08-01), Chopra
patent: 6284660 (2001-09-01), Doan
patent: 6306012 (2001-10-01), Sabde
patent: 6306014 (2001-10-01), Walker et al.
patent: 6306768 (2001-10-01), Klein
patent: 6312558 (2001-11-01), Moore
patent: 6328632 (2001-12-01), Chopra
patent: 6331488 (2001-12-01), Doan et al.
patent: 6350180 (2002-02-01), Southwick
patent: 6350691 (2002-02-01), Lankford
patent: 6352466 (2002-03-01), Moore
patent: 6354923 (2002-03-01), Lankford
patent: 6354930 (2002-03-01), Moore
patent: 6358122 (2002-03-01), Sabde et al.
patent: 6358127 (2002-03-01), Carlson et al.
patent: 6358129 (2002-03-01), Dow
patent: 6361417 (2002-03-01), Walker et al.
patent: 6364757 (2002-04-01), Moore
patent: 6368190 (2002-04-01), Easter et al.
patent: 6368193 (2002-04-01), Carlson et al.
patent: 6368194 (2002-04-01), Sharples et al.
patent: 6368197 (2002-04-01), Elledge
patent: 6376381 (2002-04-01), Sabde
patent: 6447380 (2002-09-01), Pham et al.
patent: 6648734 (2003-11-01), Chin et al.
patent: 2004/0018804 (2004-01-01), Taylor
Kondo, Seiichi, et al., “Abrasive-Free Polishing for Copper Damascene Interconnection,” Journal of the Electrochemical Society, vol. 147, No. 10, pp. 3907-3913 (2000).
Micro)n Technology, Inc.
Nguyen George
Perkins Coie LLP
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