Plastic and nonmetallic article shaping or treating: processes – With severing – removing material from preform mechanically,... – Surface finishing
Reexamination Certificate
2007-01-09
2007-01-09
Hassanzadeh, Parviz (Department: 1763)
Plastic and nonmetallic article shaping or treating: processes
With severing, removing material from preform mechanically,...
Surface finishing
C451S031000
Reexamination Certificate
active
10684358
ABSTRACT:
The invention provides a unitary retaining ring for use in a CMP apparatus. The retaining ring features a pad engaging surface which is designed to be flat and planar when the retaining ring is mounted to a carrier of the CMP apparatus. The pad engaging surface includes portions which surround the wafer and contact a pad and slurry on the CMP apparatus. A plurality of mounting features are provided along a carrier engaging surface of the ring. The mounting features are installed to cause localized compressive stresses in the material when in a demounted state. Upon mounting to a carrier of the CMP apparatus under specified torque or force conditions, tensile stresses are applied to the material of the ring resulting in a flat and planar mounted front surface.
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Easter William G.
Willis George D.
Barley Snyder LLC
Hassanzadeh Parviz
MacArthur Sylvia R.
Semplastics, LLC
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