Retaining heat sinks on printed circuit boards

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S710000, C361S718000, C024S457000, C024S458000, C411S508000, C257S719000

Reexamination Certificate

active

10804413

ABSTRACT:
A heat sink assembly may be plugged into a receiving element in a printed circuit board. A retention element includes upper and lower portions. The lower portion may be plug locked onto a printed circuit board. The upper portion then telescopes into and releaseably locks in the lower portion. The upper portion may include a rod which may be rotated to free the upper portion from the lower portion for disassembly.

REFERENCES:
patent: 3220078 (1965-11-01), Preziosi
patent: 4007516 (1977-02-01), Coules
patent: 4047266 (1977-09-01), Bisbing
patent: 4898493 (1990-02-01), Blankenburg
patent: 4969065 (1990-11-01), Petri
patent: 5586005 (1996-12-01), Cipolla et al.
patent: 5901039 (1999-05-01), Dehaine et al.
patent: 6104614 (2000-08-01), Chou et al.
patent: 6307748 (2001-10-01), Lin et al.
patent: 6412546 (2002-07-01), Lin et al.
patent: 6456490 (2002-09-01), Lai
patent: 6480387 (2002-11-01), Lee et al.
patent: 6501658 (2002-12-01), Pearson et al.
patent: 6611431 (2003-08-01), Lee et al.
patent: 6752577 (2004-06-01), Chen et al.
patent: 6866455 (2005-03-01), Hasler
patent: 6866540 (2005-03-01), Robertson
patent: 6874983 (2005-04-01), Moerke et al.
patent: 6934155 (2005-08-01), Aoki et al.
patent: 2003/0184948 (2003-10-01), Settergren et al.
patent: 2004/0047130 (2004-03-01), Liu
patent: 2004/0052611 (2004-03-01), Liu
patent: 2005/0117305 (2005-06-01), Ulen et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Retaining heat sinks on printed circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Retaining heat sinks on printed circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Retaining heat sinks on printed circuit boards will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3826325

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.