Retainer ring, Polishing head, and chemical mechanical...

Details Retainer ring, Polishing head, and chemical mechanical... Retainer ring, Polishing head, and chemical mechanical...

2007-05-08

2007-05-08

Wilson, Lee D. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Controlling temperature

C451S053000, C451S006000, C451S041000, C451S285000

Reexamination Certificate

active

11513122

ABSTRACT:
A retainer ring configured to reduce heat generated during a polishing process may include a heat absorbing element, a thermoelectric element, and a heat dissipating element. A polishing head configured to polish a wafer may include a wafer carrier, a retainer ring, and a cooling element. A chemical mechanical polishing apparatus including a polishing pad formed on a platen and a polishing head including a retainer ring.

REFERENCES:
patent: 5605488 (1997-02-01), Ohashi et al.
patent: 6464561 (2002-10-01), Sandhu et al.
patent: 6638141 (2003-10-01), Ide
patent: 6686284 (2004-02-01), Chung et al.
patent: 2004-249452 (2004-09-01), None
patent: 10-2005-0033736 (2005-04-01), None

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