Retainer ring of chemical mechanical polishing device

Details Retainer ring of chemical mechanical polishing device Retainer ring of chemical mechanical polishing device

2006-06-16

2009-11-24

MacArthur, Sylvia R. (Department: 1792)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

For liquid etchant

C156S345120

Reexamination Certificate

active

07622016

ABSTRACT:
A retainer ring of a chemical-mechanical polishing device which can prevent itself from being twisted and improve defective proportion and equipment operating rate occurred when polishing semiconductor wafers by embedding a metal member inside.Retainer ring installed to a polishing head of a chemical mechanical polishing device to fix a semiconductor wafer includes: a first member of a resin connected to a carrier of the polishing head and a room is formed inside; a second member of a metal embedded into the room of the first member.The present invention can improve a defective proportion of a semiconductor wafer polishing process by above effects and can reduce initial limitation conditions accompanied to mass production to increase an equipment operation rate by providing credibility of the retaining ring.

REFERENCES:
patent: 6277008 (2001-08-01), Masuta et al.
patent: 6824458 (2004-11-01), Ensinger
patent: 6974371 (2005-12-01), Chen et al.
patent: 2004/0259485 (2004-12-01), Ensinger
patent: 2007/0034335 (2007-02-01), Lee
patent: KR1020010055213 (2001-07-01), None
Machine generated translation of KR1020010055213, 9 pages, Published Jul. 2001.

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