Retainer frame assembly for dissipating heat generated on an int

Heat exchange – With retainer for removable article – Electrical component

Patent

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Details

165185, 257718, 361704, H05K 720, H01L 2302

Patent

active

054779162

ABSTRACT:
A retainer frame assembly for dissipating heat generated on an integrated circuit chip comprising a generally rectangular base frame configured to enclose a chip, a heat-dissipating cover to be disposed on the chip and a movable rod manipulatable to be in a non-locked position, in which the cover loosely rests on the chip, or a locked position, in which the cover is pressingly retained to the chip. The retention of the cover to the chip is achieved by a first positioning piece provided on one side of the base frame and a second positioning piece provided on an opposite side of the base frame and a first and a second complementary locking pieces adjacent to the first positioning piece, in cooperation with the movable rod. The rod is substantially L-shaped having an intermediate offset portion which, when the rod is rotated about its axis, changes position to correspond to the non-locked position and the locked position.

REFERENCES:
patent: 4509839 (1985-04-01), Lavochkin
patent: 5019940 (1991-05-01), Clemens
patent: 5307239 (1994-04-01), McCarty et al.
patent: 5386338 (1995-01-01), Jordan et al.

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