Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2002-12-16
2004-06-22
Luebke, Renee (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
06752636
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to retainer devices for electronic packages, and particularly to a retainer device which exerts no pressure on an electronic package once a heat sink has been attached to the electronic package.
2. Prior Art
A conventional land grid array (LGA) socket often comprises a retainer device to press a central processing unit (CPU) against the socket in advance. A heat sink is then attached to the CPU by a clamp. Referring to
FIG. 6
, a conventional retainer device
80
for an LGA socket
86
comprises a rectangular base
81
, a crank
82
pivotably attached to one side of the base
81
, and a clip
83
pivotably attached to an opposite side of the base
81
. The socket
86
is surrounded by the base
81
. A CPU
87
is placed on the socket
86
. When the clip
83
is rotated downwardly, a distal hook
85
thereof enters a space under an offset pressing lever of the crank
82
. The crank
82
is then rotated toward the CPU
87
until the pressing lever of the crank
82
engagingly presses the hook
85
. A pair of curve pressing portions
84
is formed at opposite sides of the clip
83
, for resiliently pressing the CPU
87
.
When a heat sink is attached onto the CPU
87
, it depresses the CPU
87
slightly. The pressing portions
84
continue to resiliently exert pressure on the CPU
87
. That is, the CPU
87
is subjected to pressure exerted by both the heat sink and the pressing portions
84
. The combined pressure is liable to damage the CPU and/or solder balls of the socket that contact an underside of the CPU.
Thus, a retainer device for a socket that can solve the above-mentioned problems is desired.
BRIEF SUMMARY OF THE INVENTION
Accordingly, an object of the present invention is to provide a retainer device which can press an electronic package such as a CPU onto a socket, and which can exert no pressure on the electronic package once a heat sink has been attached to the electronic package.
Another object of the present invention is to provide a retainer device which has simple structure.
To achieve the above-mentioned objects, a retainer device in accordance with a preferred embodiment of the present invention is for securing a CPU to a socket. The retainer device comprises a base, a clip pivotably attached to a rear of the base, and a crank pivotably attached to a front of the base. The clip has a frame, and a pair of supporting flanges and a pair of pressing tabs depending from the frame. A hook depends from a front of the clip. The crank has an offset pressing lever and an operation rod. When the operation rod is rotated down toward the socket, the pressing lever drives the hook downwardly. The supporting flanges abut against the base, and the pressing tabs press the CPU. When a heat sink is attached to the CPU, it slightly depresses the CPU. The supporting flanges maintain the pressing tabs at a same level, and therefore the CPU moves downwardly away from contact with the pressing tabs. No pressure is exerted on the CPU by the pressing tabs.
Other objects, advantages and novel features of the present invention will be drawn from the following detailed description of the preferred embodiment of the present invention with the attached drawings, in which:
REFERENCES:
patent: 5100333 (1992-03-01), Suzuki
patent: 5485351 (1996-01-01), Hopfer et al.
patent: 5807104 (1998-09-01), Ikeya et al.
Chung Wei Te
Hon Hai - Precision Ind. Co., Ltd.
Luebke Renee
McCamey Ann
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