Retainer and wafer polishing apparatus

Details Retainer and wafer polishing apparatus Retainer and wafer polishing apparatus

2006-08-22

2006-08-22

Ackun, Jr., Jacob K. (Department: 3723)

Abrading

Abrading process

With critical nonabrading work treating

C451S056000, C451S286000, C451S398000

Reexamination Certificate

active

07094133

ABSTRACT:
When a wafer is pressed on a rotating polishing pad and its surface is polished, a retainer retains the periphery of the wafer to prevent the wafer from being detached from the polishing pad. The retainer includes a first ring which surrounds the wafer and contacts the polishing pad and a second ring which is provided outside the first ring in the radial direction of the wafer and contacts the polishing pad. The second ring has wear resistance that is higher than that of the first ring.

REFERENCES:
patent: 6139428 (2000-10-01), Drill et al.
patent: 6390904 (2002-05-01), Gleason et al.
patent: 6899610 (2005-05-01), Cooper et al.
patent: 2004/0123951 (2004-07-01), Kramer et al.
patent: 2002-18709 (2002-01-01), None
patent: 2002-0065965 (2002-08-01), None
Korean Patent Office “Notification for Filing Opinion” dated Feb. 8, 2006, issued in counterpart Korean Application No. 10-2004-59473.

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