Restorable backbond for LSI chips using liquid metal coated dend

Electricity: conductors and insulators – Feedthrough or bushing – Compression

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

357 81, 357 66, 357 79, 174 16HS, 165 80C, H01L 2504, H01L 2302, H01L 2348

Patent

active

042544319

ABSTRACT:
An improved arrangement for cooling a module packaged semiconductor integrated circuit chip having heat generating microcircuits thereon is disclosed. Enhanced cooling over prior art techniques is achieved by utilizing an interfacial layer of liquid metal alloy coated metallic dendrites, which layer is sandwiched between two facing surfaces of the chip and a heat sink. Appropriate biasing means are also provided to urge the dendritic projections into piercing engagement with the liquid metal alloy layer, the biasing means being thermally coupled between the heat sink and the module container to thereby aid in forming unitary heat transfer path from the chip to the module container. The biasing means are adapted to provide sufficient force to cause the dendritic projections to engage and retain the liquid metal alloy layer and to non-destructively force the layer to fill all available space between the chip and the heat sink.

REFERENCES:
patent: 3226608 (1965-12-01), Coffin
patent: 3248615 (1966-04-01), Weisshaar
patent: 3271638 (1966-09-01), Murad
patent: 3328642 (1967-06-01), Haumesser et al.
patent: 4129881 (1978-12-01), Reichei et al.
IBM Technical Disclosure Bulletin, vol. 19, No. 5, Oct. 1976, Inner Fin Air Cooled Module by Cupta, p. 1804.
IBM Technical Disclosure Bulletin, vol. 20, No. 10, Mar. 1978; by Johnson, Device cooling, pp. 3919 & 3920.
IBM Technical Disclosure Bulletin, vol. 21, No. 1, Jun. 1978, by Blake, Packaging Structure, pp. 183 & 184.
IBM Technical Disclosure Bulletin, vol. 16, No. 3, Aug. 1973, by Van Vestrout; Floating Backbond Mounting for a Chip Device.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Restorable backbond for LSI chips using liquid metal coated dend does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Restorable backbond for LSI chips using liquid metal coated dend, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Restorable backbond for LSI chips using liquid metal coated dend will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-82616

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.