Metal fusion bonding – Means to apply vibratory solid-state bonding energy to work
Reexamination Certificate
2002-07-03
2003-12-30
Elve, M. Alexander (Department: 1725)
Metal fusion bonding
Means to apply vibratory solid-state bonding energy to work
C228S004500
Reexamination Certificate
active
06669074
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a resonator for ultrasonic bonding used to weld a bonding wire by ultrasonic waves for the production of a semiconductor device.
2. Description of the Prior Art
FIG. 4
shows a prior art ultrasonic bonding machine used for the production of a semiconductor device. When a bonding wire
101
such as a gold wire is caused to pass through a wire path
105
formed in a capillary
104
installed at the end of an ultrasonic horn
103
through a clamper
102
, the end of the bonding wire
101
projecting downward from the end of the capillary
104
is moved down together with the ultrasonic horn
103
and the capillary
104
to be placed upon an electrode in an unshown semiconductor device or lead frame to be bonded and sandwiched between the electrode and the capillary
104
, and the ultrasonic horn
103
and the capillary
104
are vibrated by ultrasonic waves to bond the end of the bonding wire
101
to the electrode.
However, since the capillary
104
is connected to the end of the ultrasonic horn
103
which is mounted to the ultrasonic bonding machine in such a manner that it is supported on one side in the prior art, the ultrasonic horn
103
is bent by pressure for bonding the bonding wire
101
to the electrode with a support point for the ultrasonic bonding machine as a fulcrum, whereby the bonding position between the bonding wire
101
and the electrode is slightly changed, thereby making it impossible to carry out suitable bonding.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to provide a resonator for ultrasonic bonding, which is able to carry out suitable bonding by supporting the ultrasonic horn on both side of the capillary to maintain the bonding position between the bonding wire and the electrode accurately.
Since the ultrasonic horn comprises support portions which are situated at minimum vibration amplitude points on both sides of the capillary for passing the bonding wire therethrough in the present invention, the ultrasonic horn is mounted to an unshown bonding machine by the support portions in such a manner it is supported on both sides. Therefore, when the end portion of the bonding wire is sandwiched between an object to be bonded and the capillary by predetermined pressure, the ultrasonic horn is bent at the bonding position between the bonding wire and the object to be bonded by the pressure for bonding the bonding wire to the object to be bonded, thereby making it possible to maintain the bonding position between the bonding wire and the object to be bonded accurately and to bond the bonding wire to the object to be bonded suitably. Since the ultrasonic horn is mounted to the bonding machine in such a manner that it is supported on both sides with the capillary as the center, pressure applied to the bonding wire from the capillary at the time of bonding is well balanced on right and left sides, thereby making it possible to use a thin wire, thick wire or wire coated with a polymer material as the bonding wire.
REFERENCES:
patent: 5326014 (1994-07-01), Morita
patent: 5443240 (1995-08-01), Cunningham
patent: 5603444 (1997-02-01), Sato
patent: 5884833 (1999-03-01), Sato et al.
patent: 6109502 (2000-08-01), Sato
patent: 6168063 (2001-01-01), Sato et al.
patent: 6491785 (2002-12-01), Sato et al.
patent: 0655815 (1995-05-01), None
patent: 1074330 (2001-02-01), None
patent: 2001168142 (2001-06-01), None
patent: 2002043377 (2002-02-01), None
Cooke Colleen P.
Elve M. Alexander
Kanesaka & Takeuchi
Ultex Corporation
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