Resonator and component with hermetic encapsulation

Details Resonator and component with hermetic encapsulation Resonator and component with hermetic encapsulation

2008-06-10

2008-06-10

Jones, Stephen E. (Department: 2817)

Wave transmission lines and networks

Coupling networks

Electromechanical filter

C333S191000, C333S192000

Reexamination Certificate

active

07385467

ABSTRACT:
Proposed is a resonator which works with bulk acoustic waves and is based on a layer structure known in the art, which is arranged over a substrate. According to the invention, the total surface of the layer structure, including all resonators contained therein, is covered with a dielectric layer and a metal layer which together form an acoustic mirror, a low-k dielectric being used for the dielectric layer. The total-surface mirror offers broadband functionality over a suitable frequency range. The dielectric contained within the mirror acts as a sealing protective layer for the resonator or resonators.

REFERENCES:
patent: 5872493 (1999-02-01), Ella
patent: 6087198 (2000-07-01), Panasik
patent: 6441703 (2002-08-01), Panasik
patent: 6744336 (2004-06-01), Goetz et al.
patent: 6768396 (2004-07-01), Klee et al.
patent: 2001/0028285 (2001-10-01), Katharine et el.
patent: 0 865 157 (1998-09-01), None
patent: 1 070 677 (2001-01-01), None
patent: 1 071 126 (2001-01-01), None

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