Resonating conductive traces and methods of using same for...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

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C156S272400

Reexamination Certificate

active

07901536

ABSTRACT:
Conductive traces and patterns of same are used to bond components together via electromagnetic radiation. Each conductive trace is configured to resonate and heat up when irradiated with electromagnetic radiation, such as microwave energy and/or RF energy, having a wavelength that is about 2.3 times the length of the conductive trace. The conductive traces may be arranged in a pattern to uniformly heat a target area of a substrate or other component to a selected temperature when irradiated with electromagnetic radiation.

REFERENCES:
patent: 6312548 (2001-11-01), Fathi et al.
patent: 103 48 253 (2005-02-01), None
patent: 1 155 798 (2001-11-01), None
patent: 1037077 (1966-07-01), None
International Search Report and Written Opinion of International Searching Authority corresponding to PCT/US2007/012750, mailed Dec. 27, 2007.

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