Resonance elimination in high speed packages

Details Resonance elimination in high speed packages Resonance elimination in high speed packages

2000-10-04

2003-04-08

Pascal, Robert (Department: 2817)

Wave transmission lines and networks

Long line elements and components

Strip type

C333S257000

Reexamination Certificate

active

06545573

ABSTRACT:

FIELD OF THE INVENTION
This invention relates to microelectronics, and specifically to microwave frequency optical packages.
BACKGROUND OF THE INVENTION
Microwave resonance in high-speed packages sometimes degrades the performance of the packages by deleteriously increasing the return loss of electrical signals fed into the package. The conventional approach to reduce the microwave resonance is to introduce thick sheets of resistive polymers, far from the launch site, onto the walls or lid of the packages to absorb microwaves after they are generated. However, with communication frequencies constantly increasing, this approach is insufficient to achieve the decrease in return loss desired, particularly at a time when the microwave spectrum technology is extending from 1 to 40 GHz and above.
SUMMARY OF THE INVENTION
A microwave package includes a housing having a moat formed in the housing to suppress microwave resonant energy. The moat may be filled with microwave absorbent material to further suppress microwave resonant energy.


REFERENCES:
patent: 4575701 (1986-03-01), Greed
patent: 4802178 (1989-01-01), Ury
patent: 5030935 (1991-07-01), Williams et al.
patent: 5260513 (1993-11-01), Giles et al.
patent: 5773151 (1998-06-01), Begley et al.
patent: 6121833 (2000-09-01), Rattay et al.
patent: 6157544 (2000-12-01), Ferling et al.

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