Resoldering tool for ceramic substrate hybrid electronic circuit

Metal fusion bonding – Process – Repairing – restoring – or renewing product for reuse

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228 19, 228 51, 228191, 228264, B23K 100

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044416474

ABSTRACT:
A reworking tool for ceramic substrate hybrid circuits has a metal base for sitting on a heated surface, a support member support above the base and a pillar of heat conductive material attached to the base and extending up through an aperture in the support member. The top surfaces of pillar and support member are in a common plane. By this means a "hot spot" is produced at the top of the pillar and a hybrid circuit positioned on the support member can be so positioned that a particular component position is resting on the top of the pillar. Solder at this component position will melt and a component can be removed, or a component added or a component removed and another placed in position. Lateral sliding of the hybrid circuit laterally on the support member enables the solder to solidify.

REFERENCES:
patent: 3050612 (1962-08-01), Eversole
patent: 3058440 (1962-10-01), Berry
patent: 3815806 (1974-06-01), Paxton
patent: 3879836 (1975-04-01), Coffin
patent: 4136444 (1979-01-01), Durney
patent: 4152822 (1979-05-01), Duff
patent: 4193160 (1980-03-01), Vandermark
Desoldering-Soldering Apparatus, by V. A. Corsaro, Technical Digest No. 33, 1974, pp. 25-26.

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