Resistor substrate containing carbon fibers and having a smooth

Details Resistor substrate containing carbon fibers and having a smooth Resistor substrate containing carbon fibers and having a smooth

1997-04-09

1998-07-14

Hoang, Tu B.

Electrical resistors

Incased, embedded, or housed

Element embedded or enclosed in groove or recess

338160, 338161, 338311, H01L 102

Patent

active

057811008

ABSTRACT:
A resistor substrate in which a resistor layer having an electroconductive powder and carbon fibers dispersed in a heat resistant resin is molded into a substrate comprising a heat resistant thermosetting molding material, and the surface of the resistor layer is in a mirror-finished state. The resistor substrate is manufactured by printing the resistor layer on a metal plate and heat-curing the same, molding the resistor layer formed on the metal plate in a die into a substrate shape with a heat resistant thermosetting resin and peeling the metal plate and transferring the resistor layer to the substrate molded from the heat resistant thermosetting resin.

REFERENCES:
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patent: 4350741 (1982-09-01), Hasegawa et al.
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patent: 4568798 (1986-02-01), Ambros et al.
patent: 4722765 (1988-02-01), Ambros et al.
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patent: 5111178 (1992-05-01), Bosze
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EP 0259709 translation (Ambros et al.) prev. cited., Paper No. 4.
EP 0073904 translation (Ambros et al.) prev. cited., Paper No. 4.
German 4,218,938 translation (Kazmierczak) prev. cited., Paper No. 4.

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