Resistor protective layer for micro-fluid ejection devices

Details Resistor protective layer for micro-fluid ejection devices Resistor protective layer for micro-fluid ejection devices

2007-01-23

2007-01-23

Do, An H. (Department: 2853)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

Reexamination Certificate

active

10846323

ABSTRACT:
A heater chip for a micro-fluid ejection device having enhanced adhesion between a resistor layer and a protective layer. The heater chip includes a substrate, a resistive layer deposited adjacent to the substrate, and a substantially non-conductive protective layer adjacent to the resistive layer. The protective layer is selected from a titanium-doped diamond-like carbon thin film layer, and a single thin film diamond-like carbon layer having at least a first surface comprised of more than about 30 atom % titanium.

REFERENCES:
patent: 5306529 (1994-04-01), Nishimura
patent: 5786068 (1998-07-01), Dorfman et al.
patent: 6139131 (2000-10-01), Prasad et al.
patent: 6155675 (2000-12-01), Nice et al.
patent: 6331332 (2001-12-01), Wang
patent: 6337151 (2002-01-01), Uzoh et al.
patent: 2004/0005502 (2004-01-01), Schlag
patent: 0 632 344 (1995-01-01), None
patent: WO 99/62077 (1999-12-01), None
patent: WO 00/44032 (2000-07-01), None
“Doping induced internal stress reduction in diamondlike carbon films by pulsed laser ablation.” Written by Q. Wei, et al.MRS Symposium Proceedings V498 pp. 61-66 1998.
“Design of a Ti/TiC/DLC functionally gradient coating.” Written by A.A. Voevodin, et al. Thin Solid Films V298 pp. 107-115 1997.
“Composition and structure of Ti-C/DLC graded composite films.” Written by Sun Ming-ren and Xia Li-fang. Trans. of the Nonferrous Metals Soc. of China V12 No. 2 pp. 246-250 Apr. 2002.
“A comparison study of diamond adhesion on ductile metals.” Written by Ali Nassar Thin Solid Films V337-338 pp. 193-197 Dec. 2000.

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