Resistor compositions for electronic circuitry applications

Details Resistor compositions for electronic circuitry applications Resistor compositions for electronic circuitry applications

2007-11-19

2009-10-20

Kopec, Mark (Department: 1796)

Compositions

Electrically conductive or emissive compositions

C252S518100, C252S519330, C524S600000, C106S001050

Reexamination Certificate

active

07604754

ABSTRACT:
Resistor compositions are disclosed, made from polymer thick film resistor formulations comprising a polyimide component, a sterically hindered hydrophobic epoxy component and a solvent component having a Hanson polar solubility parameter between 2.1 and 3.0 and having a normal boiling point between 210 and 260° C. The weight ratio of polyimide component (“A”) to epoxy component (“B”) is A:B, where A is between and including 1 to 15 and where B is 1.

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