Resistivity analysis

Details Resistivity analysis Resistivity analysis

2006-06-13

2006-06-13

Hoff, Marc S. (Department: 2857)

Data processing: measuring, calibrating, or testing

Testing system

Of circuit

C324S750010

Reexamination Certificate

active

07062399

ABSTRACT:
According to an example embodiment of the present invention a semiconductor die having a resistive electrical connection is analyzed. Heat is directed to the die as the die is undergoing a state-changing operation to cause a failure due to suspect circuitry. The die is monitored, and a circuit path that electrically changes in response to the heat is detected and used to detect that a particular portion therein of the circuit is resistive. In this manner, the detection and localization of a semiconductor die defect that includes a resistive portion of a circuit path is enhanced.

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