Resistive substrate for thermal printing ribbons comprising a mi

Details Resistive substrate for thermal printing ribbons comprising a mi Resistive substrate for thermal printing ribbons comprising a mi

1981-12-22

1983-12-20

Wright, Jr., Ernest T.

Typewriting machines

Typing by other than type-face or type-die

Thermal

400198, 4002411, 428914, B41J 3100

Patent

active

044214294

ABSTRACT:
Disclosed is a thermal transfer medium which comprises a mixture of a thermosetting polyimide, a thermoplastic polyimide, and graphite. It has a steel support layer and an intermediate layer of silicon dioxide. An outer layer on the steel is the thermal ink. The mixture is applied as a dispersion with a precursor of the thermosetting polyimide. The ribbon may be recoated at the typing station by applying a hot melt of the ink.

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IBM Technical Disclosure Bulletin, "Thermal Efficiency Improvement by Anodization", Bowlds et al., vol. 24, No. 3, Aug. 1981, pp. 1356-1357.

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