Resistive printhead arrays for thermal transfer printing

Details Resistive printhead arrays for thermal transfer printing Resistive printhead arrays for thermal transfer printing

1987-12-14

1989-08-22

Shaw, Clifford C.

Recorders

Thermal recording

219216, 219543, 400120, G01D 1510, H05B 100

Patent

active

048600300

ABSTRACT:
A thermal transfer printing device, including an ink donor supporting an ink meltable upon the application of a selected temperature, a printing head supporting a resistive heating element for generating the selected temperature at the ink donor, and means for bringing a final image support surface into contacting relationship with the ink donor in timed relationship to the application of the selected temperature to the ink donor including an electrically conductive heat sink layer, a heat resistant organic material having a very low thermal conductivity deposited on the heat sink layer and an array of resistors, supported on the heat resistant organic material, each resistor selectively controllable to apply a melting temperature to the meltable ink. The heat resistant organic material having a very low thermal conductivity is desirably a polyimide.

REFERENCES:
patent: 4030408 (1977-06-01), Miwa
patent: 4296309 (1981-10-01), Shinmi et al.
patent: 4561789 (1985-12-01), Saito
patent: 4626872 (1986-12-01), Tameno
patent: 4668962 (1987-05-01), Stallkamp

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