Resistive film

Details Resistive film Resistive film

1995-01-12

1996-08-06

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428209, 428457, 361767, 174261, B32B 900

Patent

active

055432085

ABSTRACT:
A resistive layer with the elements nickel, chromium, aluminum, cooper and silicon has a low temperature coefficient and a high degree of long-time stability. The copper content is to 5.5 weight-% and the silicon content is 0.5 to 1.6 weight-%, respectively in relation to aluminum, and the ratio of Ni: Cr: AlSiCu is within a range which is defined by a hexagon ABCDEF shown in FIG. 1, the corner points of which are provided by the following compositions in weight-%:

REFERENCES:
Patent Abstracts of Japan, vol. 3, No. 117 (E-141) Sep. 29, 1979 of JP-A-54 094 696 (Matsushita Electric Ind. Co., Ltd) Jul. 26, 1979.
R. Kaneoya, "Studies of High-Accuracy Ni-Cr Thin-Film Resistors"; Electronic and Communications in Japan, vol. 52-C, No. 11, (1969), pp. 162-170.

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