Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2006-10-03
2008-12-16
Lebentritt, Michael S (Department: 2829)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S108000, C438S111000, C438S116000, C257SE21121, C257SE21131, C257SE21141
Reexamination Certificate
active
07465606
ABSTRACT:
A method of connecting stranded wire to a lead-frame body10includes the provision of a stranded wire12.It is ensured that insulation is stripped from an end14of the stranded wire. An electrically conductive lead-frame connection structure16is associated with the lead-frame body. The end14of the stranded wire is inserted into the lead-frame connection structure16so that the lead-frame connection structure substantially surrounds the wire end. Solder flux is injected so as to be substantially about a portion of the end of the stranded wire. The lead-frame connection structure is placed in contact with a bottom resistance welding electrode18or a top resistance welding electrode20.The electrode that is not presently in contact with the lead-frame connection structure is moved so as to contact the lead-frame connection structure to resistance weld the wire end14to the lead-frame connection structure16and thereby define a solder crimp connection22of the wire end and the lead-frame connection structure.
REFERENCES:
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patent: 5465016 (1995-11-01), Mancl et al.
patent: 5774976 (1998-07-01), Stark
patent: 6519832 (2003-02-01), DeHart
patent: 2006/0261691 (2006-11-01), Minke et al.
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Brouwers Johannes
DeWys John William
Makaran John Edward
Tyshchuk Sergey
Van Duynhoven Murray
Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Wurzb
Lebentritt Michael S
Manelli Denison & Selter PLLC
Stemberger Edward J.
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