Resistance reflow soldering apparatus

Details Resistance reflow soldering apparatus Resistance reflow soldering apparatus

1982-06-11

1984-07-17

Envall, Jr., Roy N.

Electric heating

Metal heating

For bonding with pressure

219 85F, 219 85G, B23K 112

Patent

active

044608179

ABSTRACT:
A small-sized light-weight resistance reflow soldering apparatus for modifying the wiring pattern on a printed circuit board, with the soldering apparatus including a heating device with an adjustable weight, a supporting mechanism for a vertically movably supporting the heating device, a welding power supply for making the heating device produce heat enough to melt the solder for a predetermined time length, and a case accomodating these constituents. The soldering is effected by the heating device which produces the heat while being pressed against the jointing surface.

REFERENCES:
patent: 4351468 (1982-09-01), Floury et al.

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