Resist removing method, and curable pressure-sensitive adhesive,

Details Resist removing method, and curable pressure-sensitive adhesive, Resist removing method, and curable pressure-sensitive adhesive,

1994-08-11

1995-11-14

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156234, 156241, 1562755, 1562757, B32B 710, B32B 3100

Patent

active

054663253

ABSTRACT:
A method for removing a resist pattern formed on a semiconductor wafer, and a curable pressure-sensitive adhesive, adhesive sheets and an apparatus used for the method. The resist-removing method comprising adhering an adhesive tape on an upper surface of a resist pattern formed on an article and peeling off the resist pattern together with the adhesive tape; the curable pressure-sensitive adhesive constituting the adhesive tape, comprising a pressure-sensitive adhesive polymer containing a non-volatile compound having at least one unsaturated double bond in the molecule and having a good affinity with a resist material to be removed; the adhesive sheet comprising a film substrate having formed thereon the curable pressure-sensitive adhesive; and the resist-removing apparatus comprising a means for press-adhering the adhesive tape, a tape-peeling means, and a substrate-washing means.

REFERENCES:
patent: 4233395 (1980-11-01), Klupfel et al.
patent: 4497686 (1985-02-01), Weglin
patent: 4631110 (1986-12-01), Tsumura et al.
patent: 4869767 (1989-09-01), Robinson et al.
patent: 5110388 (1992-05-01), Komiyama et al.

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