Resist removing method

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

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Details

156247, 156311, 156344, 156349, 156584, 438458, B32B 3116, C09J 506, G05G 1500, H01J 2130

Patent

active

060996757

ABSTRACT:
An adhesive tape is applied to an article covered with a resist pattern. The article with the adhesive tape applied thereto is rapidly cooled to form cracks in the resist pattern on the surface of the article to weaken the cohesion between the resist pattern and the surface of the article. After the cooling, the adhesive tape is separated from the article, whereby the resist pattern is removed with the adhesive tape from the surface of the article.

REFERENCES:
patent: 4631103 (1986-12-01), Ametani
patent: 4775438 (1988-10-01), Funakoshi et al.
patent: 5009735 (1991-04-01), Ametani et al.
patent: 5466325 (1995-11-01), Mizuno et al.
patent: 5759336 (1998-06-01), Yamamoto et al.
patent: 5891298 (1999-04-01), Kuroda et al.

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