Resist reflow method for making submicron patterned resist masks

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427 43, 427 44, 427 82, 427 96, 427259, 427273, 427335, 427336, 96 36, 96 362, B05D 304, B05D 312

Patent

active

040229327

ABSTRACT:
The method for making patterned resist masks having minimum opening dimensions. The mask is prepared initially using standard photo or electron beam lithography techniques to yield the smallest aperture dimensions consistent with the state-of-the-art. Then, the resulting mask is placed within a chamber containing an atmosphere of resist solvent vapor. The vapor is absorbed by the patterned resist mask causing controlled resist reflow which uniformly reduces the dimensions of the resist openings by an amount determined by time, temperature, resist thickness, resist type and solvent used.

REFERENCES:
patent: 243200 (1881-06-01), Bradley
patent: 2138578 (1938-11-01), Hershberger
patent: 2294479 (1942-09-01), Peter
patent: 3339526 (1967-09-01), Bradley
patent: 3539381 (1970-11-01), Kayarian
patent: 3597257 (1971-08-01), Dunn
patent: 3737499 (1973-06-01), Kaming
Galindo et al., IBM TDB, vol, 13, No. 5, (10-1970), p. 1266, Method of Photoresist Appl.
Esch et al., IBM TDB, vol. 16, No. 6, (11-1973), Rheology...by Spin, pp. 1730-1731.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Resist reflow method for making submicron patterned resist masks does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resist reflow method for making submicron patterned resist masks, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resist reflow method for making submicron patterned resist masks will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1983965

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.