Resist processing system and resist processing method

Details Resist processing system and resist processing method Resist processing system and resist processing method

1998-08-21

2000-11-14

Walberg, Teresa

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

118729, 432128, F27B 514

Patent

active

061473294

ABSTRACT:
The substrate unloaded from the exposure device is received at the interface unit, and then carried by the substrate carrying means to the heat treatment unit, where a heat treatment is carried out on the substrate. After that, the substrate is carried from the heat treatment unit to the cooling unit, where the substrate is cooled. After the completion of the cooling process, the substrate is carried by the carrying means from the cooling unit to the development unit, where the resist film on the substrate is developed. In this resist process, the required time for the process at the heat treatment unit is changed in accordance with the required time for the process at the exposure unit. The required time for the process at the heat treatment unit is equalized with the required time for the process at the exposure device. The required time for the process at the heat treatment process is changed by prolonging or shortening the pre-process at the heat treatment unit.

REFERENCES:
patent: 5015177 (1991-05-01), Iwata
patent: 5061144 (1991-10-01), Akimoto et al.
patent: 5226056 (1993-07-01), Kikuchi et al.
patent: 5228052 (1993-07-01), Kikuchi et al.
patent: 5442416 (1995-08-01), Tateyama et al.
patent: 5516608 (1996-05-01), Hobbs et al.
patent: 5536128 (1996-07-01), Shimoyashiro et al.
patent: 5578127 (1996-11-01), Kimura

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