Resist processing process

Details Resist processing process Resist processing process

1996-01-03

1998-12-15

Graybill, David

Semiconductor device manufacturing: process

Including control responsive to sensed condition

438908, 29 2501, 430311, 430325, 430330, H01L 21306, H01L 21311, H01L 21324, G03C 500

Patent

active

058496025

ABSTRACT:
The substrate unloaded from the exposure device is received at the interface unit, and then carried by the substrate carrying means to the heat treatment unit, where a heat treatment is carried out on the substrate. After that, the substrate is carried from the heat treatment unit to the cooling unit, where the substrate is cooled. After the completion of the cooling process, the substrate is carried by the carrying means from the cooling unit to the development unit, where the resist film on the substrate is developed. In this resist process, the required time for the process at the heat treatment unit is changed in accordance with the required time for the process at the exposure unit. The required time for the process at the heat treatment unit is equalized with the required time for the process at the exposure device. The required time for the process at the heat treatment process is changed by prolonging or shortening the pre-process at the heat treatment unit.

REFERENCES:
patent: 5015177 (1991-05-01), Iwata
patent: 5516608 (1996-05-01), Hobbs et al.

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