Resist process method and system

Details Resist process method and system Resist process method and system

1997-08-29

2000-02-22

Gray, David M.

Photography

Fluid-treating apparatus

Fluid application to one side only of photographic medium

396624, 414152, G03D 500, G03D 308, B65G 2500

Patent

active

060272627

ABSTRACT:
A resist process method includes the steps of, preparing a process section for processing a wafer, means for extracting the wafer from a cassette and conveying the substrate to the process section, a cleaning section for finally cleaning the wafer processed by the process section, means for transferring the wafer from the process section to the cleaning section, and means for receiving the wafer from the cleaning section and storing the wafer in a cassette, extracting the wafer from the cassette, conveying the extracted wafer to the process section, causing the process section to include at least a process of developing the resist coated onto the wafer, transferring the wafer from the process section to the cleaning section after at least the developing process, finally cleaning the non-resist coated surface of the wafer by applying a cleaning solution to at least the non-resist coated surface of the substrate in the cleaning section, and storing the finally cleaned wafer in the cassette.

REFERENCES:
patent: 5361449 (1994-11-01), Akimoto et al.
patent: 5664254 (1997-09-01), Ohkura et al.
patent: 5826129 (1998-10-01), Hasebe et al.
patent: 5844662 (1998-12-01), Akimoto et al.

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