Resist-peeling liquid and process for peeling a resist using the

Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...

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134 23, 252544, 252548, B08B 308, B08B 310

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active

053992024

ABSTRACT:
A resist is peeled without leaving a residue after peeling, by bringing a resist-peeling liquid comprising a primary aliphatic amine of 2-6 carbon atoms into contact with the surface of an etched novolak positive photoresist, and removing the resist-peeling liquid containing the thus peeled resist from the surface of the etched resist. The used resist-peeling liquid can easily be recovered and regenerated.

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Hammond et al., "Removal of polyamide--polyimide compounds", IBM Tech. Disc. Bull., vol. 22, No. 3 Aug. 1979, p. 938.

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