Etching a substrate: processes – Forming or treating electrical conductor article
Reexamination Certificate
2006-12-22
2010-06-29
Egwim, Kelechi C (Department: 1796)
Etching a substrate: processes
Forming or treating electrical conductor article
C216S016000, C216S017000, C525S061000, C525S374000, C525S375000, C525S410000, C525S417000, C524S082000, C524S086000, C524S107000
Reexamination Certificate
active
07744768
ABSTRACT:
A resist pattern thickening material has resin, a crosslinking agent and a compound having a cyclic structure, or resin having a cyclic structure at a part. A resist pattern has a surface layer on a resist pattern to be thickened with etching rate (nm/s) ratio of the resist pattern to be thickened the surface layer of 1.1 or more, under the same condition, or a surface layer to a resist pattern to be thickened. A process for forming a resist pattern includes applying the thickening material after forming a resist pattern to be thickened on its surface. A semiconductor device has a pattern formed by the resist pattern. A process for manufacturing the semiconductor device has applying, after forming a resist pattern to be thickened, the thickening material to the surface of the resist pattern to be thickened, and patterning the underlying layer by etching, the pattern as a mask.
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Kon Junichi
Kozawa Miwa
Namiki Takahisa
Nozaki Koji
Yano Ei
Egwim Kelechi C
Fujitsu Limited
Westerman Hattori Daniels & Adrian LLP
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