Radiation imagery chemistry: process – composition – or product th – Imaged product – Structurally defined
Patent
1996-12-02
1998-05-05
Young, Christopher G.
Radiation imagery chemistry: process, composition, or product th
Imaged product
Structurally defined
430 17, 430165, 430191, G03F 7023, G03F 709
Patent
active
057471983
ABSTRACT:
A resist pattern formed on a substrate has a T-shaped cross section including a stem portion extending from the substrate surface and a cap portion connected to the stem portion and spaced from the substrate surface. Provided that .alpha. is a minimum of the angle which is defined between a tangent at the lower edge of the cap portion and the substrate surface, and h is the spacing between the lower edge of the cap portion and the substrate surface at an intermediate position, .alpha. and h fall within a range defined and encompassed by tetragon ABCD wherein A: .alpha.=0.degree., h=0.01 .mu.m, B: .alpha.=20.degree., h=0.01 .mu.m, C: .alpha.=20.degree., h=0.2 .mu.m, and D: .alpha.=0.degree., h=0.3 .mu.m. In a patterning process including the steps of coating of a resist composition to form a resist coating, exposure, reversal baking and development, at least one condition is changed by reducing the thickness of the resist coating, reducing an exposure dose, lowering a reversal baking temperature, reducing a reversal baking time, increasing a developer temperature or extending a developing time such that a resist pattern of T-shaped cross section may be formed.
REFERENCES:
IEEE Transactions of Magnetics, vol. 32, No. 1, pp. 25-30, Jan. 1996, Baubock et al., "MR Head Wafer Fabrication Technology: Current & Future Perspectives".
TDK Corporation
Young Christopher G.
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