Resist pattern forming method using anti-reflective layer resist

Details Resist pattern forming method using anti-reflective layer resist Resist pattern forming method using anti-reflective layer resist

1998-06-10

1999-11-23

Fidei, David T.

Special receptacle or package

With moisture absorbent

B65D 7302

Patent

active

059883685

ABSTRACT:
In surface packaging of thin resin packages such as surface mount resin molded memory ICs or the like, cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging. To solve this problem, the devices are sealed in a bag moisture-tight at an assembly step of the resin molded devices where the resin is still dry, and are taken out from the bags immediately before the execution of surface packaging. The devices are packaged in a moisture-proofing bag made of a laminate film, and a desiccant is sealed in the moisture-proofing bag together with the, e.g., surface mount semiconductor device having a plastic package encapsulating the semiconductor device.

REFERENCES:
patent: 2251609 (1941-08-01), Freeburg
patent: 2446361 (1948-08-01), Clibbon
patent: 2611481 (1952-09-01), Sargeant
patent: 2674509 (1954-04-01), Barnet
patent: 2814382 (1957-09-01), Lassiter
patent: 3042796 (1962-07-01), Forest
patent: 3399762 (1968-09-01), Potter
patent: 3405796 (1968-10-01), Misik
patent: 3454154 (1969-07-01), Peters et al.
patent: 3625931 (1971-12-01), Ito et al.
patent: 3704806 (1972-12-01), Plachenov et al.
patent: 3891709 (1975-06-01), Higuchi et al.
patent: 3909504 (1975-09-01), Browne
patent: 3959526 (1976-05-01), Swerlick
patent: 4026008 (1977-05-01), Drees et al.
patent: 4049121 (1977-09-01), White
patent: 4091165 (1978-05-01), Hayama
patent: 4154344 (1979-05-01), Yenni, Jr. et al.
patent: 4156751 (1979-05-01), Yenni, Jr. et al.
patent: 4156757 (1979-05-01), Graser
patent: 4160503 (1979-07-01), Ohlbach
patent: 4164503 (1979-08-01), Ohlbach
patent: 4171049 (1979-10-01), Nohara et al.
patent: 4206844 (1980-06-01), Thukamoto
patent: 4208696 (1980-06-01), Lindsay et al.
patent: 4293070 (1981-10-01), Ohlbach
patent: 4298710 (1981-11-01), Ohya et al.
patent: 4407872 (1983-10-01), Mori
patent: 4421235 (1983-12-01), Moriya
patent: 4424900 (1984-01-01), Petcavich
patent: 4480747 (1984-11-01), Kazor et al.
patent: 4496406 (1985-01-01), Dedow
patent: 4528222 (1985-07-01), Rzepecki et al.
patent: 4529087 (1985-07-01), Neal et al.
patent: 4565228 (1986-01-01), Walther
patent: 4590534 (1986-05-01), Akamatsu et al.
patent: 4648508 (1987-03-01), Neal et al.
patent: 4658958 (1987-04-01), McNully et al.
patent: 4661376 (1987-04-01), Liany
patent: 4681218 (1987-07-01), Williams
patent: 4684020 (1987-08-01), Ohlbach
patent: 4686776 (1987-08-01), Matsubara
patent: 4695926 (1987-09-01), McDermott
patent: 4699830 (1987-10-01), White
patent: 4721207 (1988-01-01), Kikuchi
patent: 4746697 (1988-05-01), Yamaguchi et al.
patent: 4756414 (1988-07-01), Mott
patent: 4757964 (1988-07-01), Kincaid et al.
patent: 4760916 (1988-08-01), Koneko et al.
patent: 4767004 (1988-08-01), Ishihara et al.
patent: 4780357 (1988-10-01), Akao
patent: 4800115 (1984-01-01), Havens
patent: 4804582 (1989-02-01), Noding et al.
patent: 4852732 (1989-08-01), Wilski et al.
patent: 4875581 (1989-10-01), Ray et al.
patent: 4906494 (1990-03-01), Babinec et al.
patent: 5607059 (1997-03-01), Kitamura et al.
"Simco-Stat Transparent Static Barrier Bags", May 1982.
"Quality Packaging Supply Corp. XT6000 Heat-Sealable, Static Shielding Material" (no date).
"BayStat Inc. Transparent Static Shield Bags" (no date).
"Ameri-Stat Static Shield Bags" (Aug. 1986).
Improvement in Reliability of Flat Plastic IC Package from the Viewpoint of Solder Mounting, Hitachi, Ltd., Musashi Factory, Akira Suzuki, Gen Murakami, Masanori Sakimoto with English translation, May 1984, pp. 303-306.
Packaging Engineer vol. 28 #1 "Transparent bags foil static electricity's zap", Jan. 1983.

Affiliated with

Also associated with

Rating

Resist pattern forming method using anti-reflective layer resist does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resist pattern forming method using anti-reflective layer resist, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resist pattern forming method using anti-reflective layer resist will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1211002