Resist pattern forming method, magnetic recording medium...

Details Resist pattern forming method, magnetic recording medium... Resist pattern forming method, magnetic recording medium...

2007-05-08

2007-05-08

Chen, Kin-Chan (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C438S725000

Reexamination Certificate

active

10982824

ABSTRACT:
A mold having a pattern of a concavo-convex surface including protrusion and recess is prepared and the pattern is transferred to a resist layer formed on a substrate by an imprinting method. The side surface of a protrusion of the transferred resist pattern is then etched so that the protrusion has a width narrower than a width of the corresponding recess formed to the mold. This resist pattern forming method is preferably applicable to a magnetic recording medium manufacturing method and a magnetic head manufacturing method.

REFERENCES:
patent: 5772905 (1998-06-01), Chou
patent: 6309580 (2001-10-01), Chou
patent: 6814897 (2004-11-01), Morita
patent: 6929762 (2005-08-01), Rubin
patent: 2004/0091748 (2004-05-01), Kamata et al.
patent: 2004/0211755 (2004-10-01), Yusa et al.
patent: 2005/0146079 (2005-07-01), Chou
patent: 2005/0164494 (2005-07-01), Nakagawa et al.
patent: 10-351605 (2000-06-01), None
patent: 2001-026256 (2002-08-01), None

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