Resist ink composition and cured article prepared therefrom

Radiation imagery chemistry: process – composition – or product th – Imaged product – Including resin or synthetic polymer

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4302801, 4302841, 4302861, 4302871, 522 97, 522 98, 522100, G03C 300

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active

055388213

ABSTRACT:
The present invention relates to a resist ink composition characterized by comprising a specific unsaturated polycarboxylic acid resin (A) or a specific unsaturated polycarboxylic acid/urethane resin (A'), a photopolymerization initiator (B), a diluent (C), and a curing component (D) and a cured article prepared therefrom.
In the formation of a solder resist pattern via selective UV-exposure through a patterned film followed by development of the unexposed part, the composition of the present invention is excellent in developability even though at a small acid value (mg KOH/g) or over a prolonged drying time and shows a resistance of the exposed part against the developing solution. Further, a cured article prepared therefrom is excellent in electroless gold plating resistance and fully satisfactory in adhesion and soldering heat resistance.

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patent: 5049628 (1991-09-01), Nawata et al.
patent: 5100767 (1992-03-01), Yanagawa et al.

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