Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...
Patent
1993-10-13
1995-01-03
Bowers, Jr., Charles L.
Radiation imagery chemistry: process, composition, or product th
Diazo reproduction, process, composition, or product
Composition or product which contains radiation sensitive...
430192, 430313, 430270, 430916, G03C 100, G03C 172, G03F 7075
Patent
active
053785851
ABSTRACT:
The present invention provides a composition having sensitivity to light or radiation. The composition comprises a polymer having a siloxane-bond structure which undergoes polymerization reaction when irridiated with light or radiation, and a sensitizing agent. The present invention also provides a process for forming a pattern, preparing a photomask and a semiconductor device by using the composition of the present invention.
REFERENCES:
patent: 3779778 (1973-12-01), Smith et al.
patent: 4442197 (1984-04-01), Crivello et al.
patent: 4491628 (1985-01-01), Ito et al.
patent: 4600685 (1986-07-01), Kitakohji et al.
patent: 4665006 (1987-05-01), Sachdev et al.
patent: 4722881 (1988-02-01), Ueno et al.
patent: 4759616 (1988-07-01), Marchant
patent: 5158854 (1992-10-01), Imamura et al.
"A Photo-Patternable Stress Relief Material for Plastic Packaged Integrated Circuits" by Myron Cagan et al. 8091 I.E.E.E. Trans. on Components, hybrids and Manuf. Tech. 11(1988) Dec., No. 4, New York, NY. pp. 611-617.
Partial-translation Examiner's Report in R.O.C. Application No. 80104934 dated May 22, 1992.
M. Morita et al., Jap. Jour. App. Physics, vol. 22, No. 10, Oct. 1983, pp. L659-L660.
R. G. Brault et al., SPIE vol. 539, 1985, pp. 70-73.
Y. Saotome et al., J. Electrochem. Soc., vol. 132, No. 4, 1985, pp. 909-913.
S. Imamura et al., SPIE vol. 920, 1988, pp. 291-294.
F. Buiguez et al. Microcircuit Engineering, 1985, pp. 471-481.
A. Steinmann et al., SPIE vol. 920, 1988, pp. 13-20.
Bowers Jr. Charles L.
Huff Mark F.
Matsushita Electronics Corporation
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