Resist coating method and resist coating apparatus

Details Resist coating method and resist coating apparatus Resist coating method and resist coating apparatus

1997-09-18

1999-12-14

Beck, Shrive

Coating processes

Centrifugal force utilized

427154, 427156, B05D 312

Patent

active

060014172

ABSTRACT:
A resist coating method includes the steps of dripping solvent onto a wafer and rotating the wafer, and then dripping resist onto the wafer and rotating the wafer. Since resist can be dispensed without waste, the total amount of resist used can be reduced. A resist coating apparatus has a wafer support for rotating a wafer placed thereupon, a first nozzle for dripping solvent onto the wafer, a second nozzle for dripping solvent onto the wafer, and a controller for controlling the dripping of resist onto the wafer after solvent has been dripped. By employing this apparatus, the total amount of resist used can thereby be reduced. Furthermore, the total amount of resist used can be further reduced by further providing a temperature controller for lowering the resist temperature to 1-5.degree. C. below room temperature.

REFERENCES:
patent: 4510176 (1985-04-01), Cuthbert et al.
patent: 4886728 (1989-12-01), Salamy et al.
patent: 5695817 (1997-12-01), Tateyama et al.

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