Resins of low thermal expansivity

Details Resins of low thermal expansivity Resins of low thermal expansivity

1987-11-17

1989-07-11

Kight, John

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From carboxylic acid or derivative thereof

528188, 528184, 5283291, C08G 7310

Patent

active

048473537

ABSTRACT:
Polyamide-imides of low thermal expansivity having a repeating structural unit of the general formula (I) ##STR1## in which Ar is a tetravalent aromatic group, A is --NHCO--, R1 through R3 are alkyl, alkoxy, or halogen, l, m, and n are integers from 0 to 4, x is 0 or 1, and y is an integer indicating the number of repeating units and in which at least one alkoxy group is present, show improved mechanical (for example, flexibility) and adhesive properties and low water absorption and are useful for the manufacture of flexible base materials for printed circuit boards, etc.

REFERENCES:
patent: 3179635 (1965-04-01), Frost et al.
patent: 3511728 (1970-05-01), Freedman et al.
patent: 3536545 (1970-10-01), Traynor et al.
patent: 4640972 (1987-02-01), Irwin

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