Resinous hollow package and producing method thereof

Details Resinous hollow package and producing method thereof Resinous hollow package and producing method thereof

2011-08-30

2011-08-30

Tran, Minh-Loan T (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S433000, C257S690000, C257S692000, C257SE23002

Reexamination Certificate

active

08008757

ABSTRACT:
The present invention provides a resinous hollow package that includes a moisture-proof island that is a planar structure disposed below a semiconductor element mounting surface of the resinous hollow package, the semiconductor element mounting surface having an area of 200 mm2or more and the maximum wave height of a wave curve of 35 μm or less. The resinous hollow package of the invention has an excellent moisture resistance due to the moisture-proof island included therein. Further, since the flatness of the semiconductor element mounting surface is excellent, decrease in the amount of light in a peripheral portion of an image can be suppressed in a digital single-lens reflex camera or the like with a large solid-state image sensor, even when a wide angle lens is used. According to the method of producing the resinous hollow package of the invention, by carrying out insert-molding while fixing the moisture-proof island with projection(s) disposed to the mold to prevent displacement thereof, the resinous hollow package having the maximum wave height of the semiconductor element mounting surface of 35 μm or less can be provided.

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PTO/ISA/210.
PTO/ISA/237.
Notifications of Reasons for Refusal issued in corresponding Japanese Patent Application No. 2007-556869 dated Mar. 1, 2011 with English Translation.

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