Resin wiring substrate, and semiconductor device and...

Details Resin wiring substrate, and semiconductor device and... Resin wiring substrate, and semiconductor device and...

2007-07-25

2010-10-19

Nguyen, Kimberly D (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S777000, C257S686000, C257SE23007, C438S125000, C438S457000

Reexamination Certificate

active

07816783

ABSTRACT:
On a surface of a resin base material (11), a first resin coating film (19) having a larger thickness and a larger area than a second resin coating film (20) formed on the other surface of the resin base material (11) is continuously formed. The second resin coating film (20) is formed so as to be separated into a plurality of portions.

REFERENCES:
patent: 2001/0022391 (2001-09-01), Ishihara et al.
patent: 2003/0197260 (2003-10-01), Nishimura et al.
patent: 3-40457 (1991-02-01), None
patent: 9-172104 (1997-06-01), None
patent: 09/172104 (1997-06-01), None

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