Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Patent
1996-10-25
1997-12-16
Krass, Frederick
Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
To produce composite, plural part or multilayered article
26427213, 26432817, 2643285, 26433112, 437212, 525481, 525523, 528 87, 528501, 528502, 428543, H01L 2156
Patent
active
056981520
ABSTRACT:
A resin tablet for sealing a semiconductor formed by solidifying a molten thermosetting resin composition by cooling, wherein the content of volatile matters in the tablet is 0.05% by weight or less, and the content of gelled particles in the tablet is 0 for the particles of 60 mesh on and is 10 ppm or less for the particles of 100 mesh on.
REFERENCES:
patent: 4293519 (1981-10-01), Knappenberger
patent: 4554126 (1985-11-01), Sera
Patent Abstracts of Japan, vol. 018 No. 372 (E-1577), 13 Jul. 1994 & JP-A-06 104301 (Nitto Denko Corp) 15 Apr. 1994.
Chemical Abstracts 118:213804, "Epoxy Adhesives in Microelectronic Hybrid Applications", Benson et al.
Chemical Abstracts 105:7206, "Removal of Volatile Substances from Epoxy Resins and Curing Agents", Bondarenko et al.
Asao Hiroyuki
Kanai Shinichi
Kimura Shoichi
Ohno Hirofumi
Taruno Tomohiro
Krass Frederick
Nitto Denko Corporation
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