Resin substrate material, electronic component substrate...

Details Resin substrate material, electronic component substrate... Resin substrate material, electronic component substrate...

2006-02-27

2011-10-25

Zacharia, Ramsey (Department: 1787)

Stock material or miscellaneous articles

Composite

Of epoxy ether

C428S416000, C428S447000, C428S457000, C428S473500

Reexamination Certificate

active

08043705

ABSTRACT:
There is provided a technology that can be applied as a substrate material to ordinary resin substrate materials and allows the adhesive strength between this substrate material and a plating metal layer to be increased; more specifically, there is provided an ordinary resin substrate material with an increased adhesive strength between the substrate material and a plating metal layer. The present invention relates to a resin substrate material such as an epoxy resin whose surface is swellable in a solution containing imidazolesilane and a palladium or other noble metal compound having a catalytic action in electroless plating and which has been surface-treated with the solution, and to an electronic component substrate material manufactured by performing electroless plating on this resin substrate material.

REFERENCES:
patent: 4024305 (1977-05-01), Alpaugh et al.
patent: 6780467 (2004-08-01), Imori
patent: 2004/0182714 (2004-09-01), Imori et al.
patent: 05-186479 (1993-07-01), None
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patent: 2000-313963 (2000-11-01), None
patent: 2002-30216 (2002-01-01), None
patent: 2002-374055 (2002-12-01), None
patent: 2002-075884 (2002-10-01), None
patent: WO 01/49898 (2001-07-01), None
patent: WO 01/81652 (2001-11-01), None
Derwent abstract for JP 08-039728A, Feb. 1996.

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