Resin substrate and ultrasonic sensor using the same

Details Resin substrate and ultrasonic sensor using the same Resin substrate and ultrasonic sensor using the same

2007-10-11

2009-12-29

Benson, Walter (Department: 2837)

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

Reexamination Certificate

active

07638931

ABSTRACT:
An ultrasonic sensor includes a resin substrate and an ultrasonic oscillator. The ultrasonic oscillator is provided approximately at the center of a component side of the resin substrate and generates and detects an ultrasonic wave. The resin substrate is made of, for example, a polycarbonate resin, i.e., the same material as a car bumper, and is shaped into a flat plate. The component side of the resin substrate is provided with a pad11adjacent to the ultrasonic oscillator. The pad is used for metal wiring based on wire bonding. The pad is made of a hard metal material excellent in conductivity and heat resistance such as stainless steel, and Al or Al alloy, for example. The resin substrate is formed as a single piece through insert molding by pouring a melted resin. Through this process, the pad is provided for the component side of the resin substrate.

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patent: 2005/0236938 (2005-10-01), Nakajima
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patent: A-2002-58097 (2002-02-01), None
patent: A-2007-19425 (2007-01-01), None

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