Resin solution compositions for electronic materials and protect

Details Resin solution compositions for electronic materials and protect Resin solution compositions for electronic materials and protect

1998-02-18

1999-06-29

Dawson, Robert

Stock material or miscellaneous articles

Composite

Of silicon containing

525423, 525476, 525422, 428446, 428413, 4284735, C08F28304, B32B 904

Patent

active

059166886

ABSTRACT:
This invention relates to resin solution compositions for electronic materials consisting of organic solutions of 100 parts by weight of siloxanepolyimidepolyamic acid copolymers composed of imide segments formed by polycondensation of aromatic tetracarboxylic acid dianhydrides and siloxanediamines and amic acid segments formed by polyaddition of aromatic tetracarboxylic acid dianhydrides and aromatic diamines other than siloxanediamines and represented by the following general formula (1) (in which X is the residue of an aromatic tetracarboxylic acid dianhydride, Y is the residue of a siloxanediamine, Z is the residue of an aromatic diamine, l and m are integers independent of each other, and n is an integer of 1 or more) and 1 to 50 parts by weight of epoxy resins. The compositions are storage-stable and curable at relatively low temperature and yield cured products with an excellent balance of heat resistance, high-frequency characteristics, chemical resistance and stress relaxation characteristics.

REFERENCES:
patent: 5252703 (1993-10-01), Nakajima et al.
patent: 5510425 (1996-04-01), Matsuura et al.
patent: 5643986 (1997-07-01), Ishikawa et al.
patent: 5677383 (1997-10-01), Ohmori et al.

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